Substrate processing method and substrate processing apparatus

Abstract

The present invention addresses the problem of preventing air bubbles from entering the gap between a first substrate and a second substrate constituting a multilayer substrate during the filling of the gap with a filler. The solution involves rotating the multilayer substrate, formed by bonding the first and second substrates, in a position where its rotation axis is parallel or inclined relative to a horizontal plane, with its peripheral portion immersed in filler stored in a storage compartment, around the rotation axis. This prevents air bubbles from entering the filler and effectively fills the gap between the peripheral portions of the first and second substrates.

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