Bond tool for die bonder and related method for use

TW202638846APending Publication Date: 2026-09-16BESI SWITZERLAND AG
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Patent Information

Application Number
TW115103388
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-01-28
Filing Date
2026-01-28
Publication Date
2026-09-16

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Abstract

Bond tool for bonding a die to a target, the bond tool comprising a die-shaping element, the die-shaping element comprising an effecting surface, wherein the effecting surface is configured to contact the die and to apply a force to the die during a bond operation in which the die is bonded to the target, a support body configured to support the die-shaping element and an interface region formed between a frontward portion of the support body and a rearward portion of the die-shaping element, wherein the interface region is configured to allow the die-shaping element to deform toward the support body due to force on the die-shaping element during the bond operation.
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