Method for manufacturing grinding equipment and semiconductor devices

Abstract

An embodiment provides a grinding apparatus and a method for manufacturing a semiconductor device, which can mitigate the impact of chips generated during grinding of the outer periphery of a semiconductor substrate. The grinding apparatus of this embodiment includes a circular blade that grinds the outer periphery of the semiconductor substrate by rotating about the center of a second rotation axis intersecting the first rotation axis, relative to the semiconductor substrate rotating about the center of a first rotation axis. The blade has a blade face including an outer peripheral edge portion capable of contacting the outer periphery of the semiconductor substrate. At least the outer peripheral edge portion of the blade face is inclined towards the first rotation axis side radially outward from the center side of the blade face.

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