Method for forming substrate with conductive pillar
TW202638867APending Publication Date: 2026-09-16COHPROS INT CO LTD
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Patent Information
- Application Number
- TW114130233
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-03-14
- Publication Date
- 2026-09-16
Smart Images
Figure TWG2TA001076227_001 
Figure TWG2TA001076227_002 
Figure TWG2TA001076227_003
Abstract
A method for forming a substrate with conductive pillar is provided. The method includes: drilling a substrate to be processed using a drilling laser to form a plurality of holes, having a first aperture, on the substrate to be processed; expanding the plurality of holes through a hole expansion laser or an etching process so that the plurality of holes have a second aperture which is larger than the first aperture, and a surface roughness of the inner wall of the plurality of holes is reduced to
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