Substrate processing methods, semiconductor device manufacturing methods, processes, and substrate processing apparatus

Abstract

This invention provides a technique for suppressing the adhesion of foreign matter (particles) to a substrate. It comprises the following steps: (a) supplying a processing gas obtained by causing a phase change in a liquid or solid phase to the substrate within a processing chamber via a path through a first section; (b) performing the following steps after (a): (b1) storing rinsing gas in a second section; (b2) supplying the rinsing gas stored in the second section to the first section, and venting the gas in the first section without passing through the processing chamber.

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