Semiconductor processing apparatus and clamping device thereof

Abstract

The present application discloses a semiconductor processing apparatus and a clamping device thereof. The clamping device comprises a base, a plurality of clamping members, and a driving mechanism. The plurality of clamping members are all disposed on the base. The driving mechanism is configured to drive the plurality of clamping members to move relative to the base, so as to clamp or release a wafer. The driving mechanism includes a first magnetic member, a second magnetic member, and a transmission element. The first magnetic member is located outside the base, and the base is provided with a cavity. The second magnetic member and the transmission element are both located within the cavity. The second magnetic member is connected to each clamping member via the transmission element. When the first magnetic member moves relative to the second magnetic member, the second magnetic member drives each clamping member to move via the transmission element. The semiconductor processing apparatus comprises a processing chamber and the aforementioned clamping device, wherein the clamping device is disposed within the processing chamber.

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