Substrate processing apparatus and its operating method

Abstract

A substrate processing apparatus is disclosed. According to one embodiment of the present invention, the substrate processing apparatus includes: a laser for irradiating an upper portion of a substrate; a fluid supply line for spraying fluid particles; a suction line for suctioning particles separated from the substrate and discharging them through a discharge port; and a controller for controlling the fluid supply line to spray fluid particles onto a multilayer film of the substrate to remove particles generated on the substrate.

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