Thermal processing apparatus

TW202638883APending Publication Date: 2026-09-16PROASIA SEMICONDUCTOR CORP
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Patent Information

Application Number
TW114107961
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-03-04
Publication Date
2026-09-16

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Abstract

The present invention relates to a thermal processing apparatus, comprising a processing chamber, a rotating susceptor, a plurality of airflow-driving elements, a support element, and a heat source. The processing chamber has an inlet and an outlet. The rotating susceptor is disposed within the processing chamber and includes a bearing that allows the rotating susceptor to rotate relative to the processing chamber. The plurality of airflow-driving elements are spaced apart and arranged around an outer surface of the rotating susceptor. The support element is disposed on the rotating susceptor and is configured to carry a substrate. The heat source is arranged on a surface of the processing chamber to provide radiant heat energy to the substrate on the support element. When an airflow enters the processing chamber through the inlet, it drives the airflow-driving elements, causing the rotating susceptor to rotate along with the support element, and is subsequently discharged through the outlet.
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