Wafer loading and unloading structures and methods, wafer inspection devices and methods
TW202638893APending Publication Date: 2026-09-16京城中安半導體設備(北京)有限公司 +1
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Patent Information
- Application Number
- TW115109299
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-12
- Filing Date
- 2026-03-12
- Publication Date
- 2026-09-16
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Abstract
This invention provides a wafer loading and unloading structure for use in a wafer inspection device, comprising: a telescopic mechanism configured to extend and retract along a direction perpendicular to the cover plate of the shockproof isolation box, extending or retracting the shockproof isolation box through an opening in the cover plate; a rotary chuck rotatably connected to the telescopic mechanism, the rotary chuck switching between a vertical and a horizontal position by rotation, and in the horizontal position cooperating with a support platform carrying the wafer to be inspected to realize the installation and / or unloading of the wafer to be inspected; the rotary chuck in the vertical position is perpendicular to the cover plate; the rotary chuck in the horizontal position is parallel to the cover plate. Because the rotary chuck of the wafer loading and unloading structure extends from the center of the cover plate of the shockproof isolation box, it avoids the center of gravity shift caused by side extension, reduces the probability of the shockproof isolation box swaying on the air-floating platform, ensures the shockproof isolation performance of the shockproof isolation box, and thus improves the inspection accuracy.
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