Bonding tool

TW202638907APending Publication Date: 2026-09-16ASML NETHERLANDS BV
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Patent Information

Application Number
TW115103513
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-05-14
Filing Date
2026-01-29
Publication Date
2026-09-16

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Abstract

A bonding tool is configured to bond a first substrate to a second substrate. The bonding tool comprises a measurement system. The measurement system is configured to measure a distance to a surface of at least one of the first substrate and the second substrate. The measurement system comprises at least one optical fiber and a radiation source. The at least one optical fiber has a distal end distanced from the surface so as to form an optical cavity of a Fabry-Pérot interferometer between the respective distal ends and the surface. The radiation source is configured to provide interrogation radiation of different wavelengths to the at least one optical fibers.
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