electrostatic chuck

Abstract

The objective of this invention is to provide an electrostatic chuck that can suppress uneven in-plane temperature distribution on a substrate during processing. The solution of this invention is an electrostatic chuck 10, comprising: a dielectric substrate 100; and a heater unit 300 for heating the dielectric substrate 100. The heater unit 300 includes: a heating layer that receives power from an external source and generates heat; an insulating layer 320 housing the heating layer internally; a first conductor plate 310A disposed such that the insulating layer 320 abuts against the dielectric substrate 100 side; and a second conductor plate 310B disposed such that the insulating layer 320 abuts against the dielectric substrate 100 side. A through-hole 304 is formed in the heater unit 300. In this electrostatic chuck 10, the diameter D1 of the through-hole 304 formed in the first conductor plate 310A is smaller than the diameter D2 of the through-hole 304 formed in the second conductor plate 310B.

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