electrostatic chuck

TW202638911APending Publication Date: 2026-09-16TOTO LTD
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Patent Information

Application Number
TW115100842
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-14
Filing Date
2026-01-09
Publication Date
2026-09-16

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Abstract

The objective of this invention is to provide an electrostatic chuck that can suppress delamination between a dielectric substrate and a conductor layer. The solution is an electrostatic chuck 10 comprising: a dielectric substrate 100 having a mounting surface; and a plurality of conductor layers disposed at different height positions within the dielectric substrate 100. When the total thickness of the conductor layers is sd (μm) and the thickness of the dielectric substrate 100 is D (mm), the electrostatic chuck 10 satisfies the condition sd < -10.5 × D + 74.5.
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