Heating device with electrostatic adsorption function

Abstract

[Problem] To provide a heating device with electrostatic adsorption function that can improve the heat uniformity of heated wafers. [Solution] A heating device (1) with electrostatic adsorption function, comprising at least: a support substrate (2), an electrostatic adsorption electrode (4) formed on the support substrate and a heating layer (5), and an insulating layer (3) formed on the electrostatic adsorption electrode and the heating layer, wherein a hole (9) is appropriately provided from the top of one of the insulating layers on which the wafer is placed to the bottom of another of the insulating layers, and the electrostatic adsorption electrode extends along a generally flat portion viewed from the cross-section of the support substrate toward the interior of the hole, or toward the lower side of the outer peripheral side of the heating device.

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