Semiconductor manufacturing equipment and wafer misalignment suppression pads

Abstract

A semiconductor manufacturing apparatus and a wafer offset suppression pad are provided for fixing and holding wafers on a wafer pick-and-place device and suppressing wafer transport offset. The semiconductor manufacturing apparatus of one embodiment includes: a receiving chamber for receiving wafers; a robotic arm for removing wafers from the receiving chamber and transporting them to a processing chamber; a robotic arm mounted on the robotic arm; a transport section mounted on the robotic arm for transporting wafers; and a plurality of holding sections mounted on the transport section for holding wafers. Each holding section includes: a planar portion; and a head disposed on the planar portion. The wafer contacts the planar portion at its end, and the head suppresses wafer transport offset.

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