Substrate processing system and maintenance method

TW202638917APending Publication Date: 2026-09-16TOKYO ELECTRON LTD
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Patent Information

Application Number
TW115119967
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2021-05-26
Filing Date
2022-05-26
Publication Date
2026-09-16

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    Figure TWG2TA001077389_003
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Abstract

The substrate processing system includes a substrate processing apparatus, a vacuum transport chamber, a transport mechanism, a suction mechanism, and a control unit. The substrate processing apparatus has a vacuum processing chamber for performing vacuum processing on the substrate. The vacuum transport chamber is connected to the vacuum processing chamber and has a transport port that communicates with the vacuum processing chamber. The transport mechanism is disposed in the vacuum transport chamber and transports the substrate through the transport port. The suction mechanism is disposed adjacent to the transport mechanism in the vacuum transport chamber and suctions adhering materials from components within the vacuum processing chamber through the transport port. The control unit controls the transport mechanism and the suction mechanism.
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