Control method of inspection apparatus for semiconductor

Abstract

This disclosure provides a control method for controlling a semiconductor wafer inspection apparatus. The control method includes: when a homing sequence is initiated, a vertical drive unit moves an imaging unit upward; a servo motor is turned off; a wafer chuck is rotated, wherein, due to the servo motor being off, a guide unit rotates with the wafer chuck; the servo motor is turned on; a chuck drive unit moves the wafer chuck to its initial position; a horizontal movement module moves the imaging unit to its initial position; and when the servo motor is driven, the lifting pins are moved upward and downward by rotating the guide unit. This prevents collisions between components, such as between the dark field illuminator and the wafer chuck lifting pins, according to the operation of the homing sequence.

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