Substrate processing device

Abstract

This invention provides a substrate processing apparatus that simplifies the piping path. The substrate processing apparatus 1 includes: a substrate holding section 22, a nozzle 23, piping 61, a nozzle holding section 71, a robotic arm 73, and a robotic arm drive section 81. The nozzle holding section 71 holds any one of the nozzles 23. The robotic arm 73 is connected to the nozzle holding section 71. The robotic arm drive section 81 moves the robotic arm 73. The robotic arm drive section 81 moves the nozzle 23 held by the nozzle holding section 71. Each nozzle 23 has a discharge port 54 and a connection portion 55. Each piping 61 has a downstream end 66. Each piping 61 is flexible. The nozzle 23 held by the nozzle holding section 71 is designated as a selection nozzle 23S. The robotic arm drive section 81 moves the discharge port 54 of the selection nozzle 23S to a processing position Q. The selection nozzle 23S can rotate relative to the robotic arm 73 about a rotation axis E. The rotation axis E passes through the discharge port 54 of the selection nozzle 23S.

Images