Substrate processing system and control method for substrate processing system

TW202638933APending Publication Date: 2026-09-16TOKYO ELECTRON LTD
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Patent Information

Application Number
TW115106746
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-04
Filing Date
2026-02-25
Publication Date
2026-09-16

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Abstract

This invention provides a substrate processing system for suppressing particle adhesion to a substrate and a control method for the substrate processing system. The substrate processing system of this invention includes: a processing chamber; a substrate support portion disposed within the processing chamber and supporting the substrate; a first vibrator disposed in the substrate support portion and generating vibrations to suppress particle adhesion to the substrate and the substrate support portion; and a control portion.
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