Manufacturing method of electronic device

Abstract

The present disclosure provides a manufacturing method of an electronic device, which includes the following steps. A first package module includes at least one metal post and a first encapsulant covering the at least one metal post is provided. A second package module is disposed in an opening of the first package module. The second package module includes an electronic component and a second encapsulant covering the electronic component. A third encapsulant is formed to at least fill a gap between the opening of the first package module and the second package module. A first circuit structure is formed on a bottom surface of the first package module. The first circuit structure is at least electrically connected to the at least one metal post of the first package module. A second circuit structure is formed on a top surface of the first package module. The second circuit structure is electrically connected to the at least one metal post of the first package module and the electronic component of the second package module.

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