Semiconductor device manufacturing method and semiconductor device
TW202638952APending Publication Date: 2026-09-16RAPIDUS CORP
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Patent Information
- Application Number
- TW114146615
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-08-15
- Filing Date
- 2025-11-28
- Publication Date
- 2026-09-16
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Abstract
A method for manufacturing a semiconductor device includes: forming a semiconductor element having a nano-crystalline transistor on a substrate, and forming wiring connected to the semiconductor element on the semiconductor element. Furthermore, the method for manufacturing a semiconductor device includes: forming a first circular opening for forming a through-hole wiring and a second circular opening for forming a linear wiring in a photosensitive photoresist layer and an interlayer insulating layer, and includes: connecting the aforementioned circular second openings to form a second linear opening.
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