Semiconductor devices and methods for manufacturing semiconductor devices

Abstract

The present invention provides a semiconductor device capable of suppressing deformation of a wafer stack stacked on a substrate and a method for manufacturing the semiconductor device. One embodiment of the semiconductor device includes: a first stack disposed on a substrate, wherein a plurality of first semiconductor wafers are stacked by offsetting them in a direction perpendicular to the stacking direction; and a second stack disposed on the substrate, wherein a plurality of second semiconductor wafers are stacked in the stacking direction; and includes a case where the upper surface of any one of the plurality of second semiconductor wafers is in contact with the lower surface of any one of the plurality of first semiconductor wafers.

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