Wiring structure, wiring formation method and semiconductor device manufacturing method

TW202638955APending Publication Date: 2026-09-16RAPIDUS CORP
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Patent Information

Application Number
TW114148363
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-10-28
Filing Date
2025-12-10
Publication Date
2026-09-16

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Patent Text Reader

Abstract

One embodiment of the wiring structure comprises: a plurality of wirings; an insulating film disposed between the plurality of wirings; and a reinforcing film in contact with the insulating film between the plurality of wirings. The reinforcing film has a higher elastic modulus than the insulating film.
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