Electronic device

Abstract

The present disclosure provides an electronic device including an interposer including a connection substrate including a substrate layer and through vias penetrating thereof, and a first and second circuit structures respectively on first and second surfaces of the substrate layer, and each including first wirings electrically connected to each other through first through vias among the through vias and second wirings thermally coupled to each other through second through vias among the through vias, an electronic unit disposed on and electrically connected to the interposer, and a heat dissipation element unit disposed on the interposer at opposite sides of the interposer, and is in contact and thermally coupled to the second wirings and the second through vias.

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