Water block
Patent Information
- Application Number
- TW114108166
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-03-05
- Publication Date
- 2026-09-16
- Estimated Expiration
- 2045-03-04
AI Technical Summary
Traditional water cooling blocks using a copper base for thermal coupling suffer from uneven heat distribution, leading to poor heat dissipation efficiency.
A water cooling head design featuring a condenser plate and a heat-absorbing plate with interconnected evaporation and condensation channels, utilizing phase-changing working fluid to uniformly transfer heat from the heat source to the condenser plate, enhancing heat exchange efficiency.
The design improves heat dissipation efficiency by uniformly conducting heat from the heat source to the condenser plate through phase-changing fluid, increasing the heat exchange efficiency between the coolant and the condenser plate.
Smart Images

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Abstract
Description
[Technical Field]
[0001] This invention relates to a water cooling head. [Previous Technology]
[0002] Conventional water cooling blocks use a copper base thermally coupled to a heat source to transfer heat generated by the heat source to the water cooling block. The coolant flowing through the water cooling block then exchanges heat with the water cooling block to dissipate the heat. However, this configuration of thermally coupling the copper base to the heat source causes heat to concentrate in one area of the copper base, making it difficult to conduct heat evenly across the entire copper base, resulting in poor heat dissipation efficiency of the water cooling block. Therefore, researchers in this field are working to solve the aforementioned problems. [Summary of the Invention]
[0003] The present invention provides a water cooling head whose structural configuration can improve heat dissipation efficiency.
[0004] One embodiment of the present invention discloses a water-cooled head comprising a body and a heat-conducting assembly. The heat-conducting assembly includes a condenser plate, a heat-absorbing plate, and a guide plate. The condenser plate is mounted on the body and has a condensation channel. The heat-absorbing plate is mounted on the side of the condenser plate away from the body and has an evaporation channel. The guide plate is disposed between the condenser plate and the heat-absorbing plate and has multiple connecting holes through which the evaporation channel communicates with the condensation channel.
[0005] Another embodiment of the present invention discloses a water-cooled head comprising a body and a heat-conducting component. The heat-conducting component includes a condenser plate and a heat-absorbing plate. The condenser plate is mounted on the body and has a plurality of condensation channels, which are straight channels and are arranged in parallel and at intervals. The heat-absorbing plate is mounted on the side of the condenser plate away from the body and has a plurality of evaporation channels, which are straight channels, are arranged in parallel and at intervals, and are connected to the condensation channels.
[0006] According to the water cooling head disclosed in the above embodiments, by means of a condenser plate mounted on the main body and a heat absorber plate mounted on the side of the condenser plate away from the main body, and the evaporation channel of the heat absorber plate being connected to the condensation channel of the condenser plate, heat generated by the heat source can be uniformly transferred from the heat absorber plate to the condenser plate through the working fluid undergoing phase change within the evaporation channel. In this way, the heat exchange efficiency between the coolant flowing through the main body and the condenser plate is improved, thereby improving the heat dissipation efficiency of the water cooling head.
[0007] The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention, and to provide a further explanation of the scope of the patent application of the present invention.
Implementation Method
[0008] Please refer to Figures 1 to 3. Figure 1 is a perspective view of the water cooling head according to the first embodiment of the present invention. Figure 2 is an exploded view of the water cooling head of Figure 1. Figure 3 is an exploded view of the water cooling head of Figure 1 from another perspective.
[0009] In this embodiment, the water-cooled head 1 includes a body 10 and a heat-conducting component 20. The heat-conducting component 20 includes a condenser plate 21 and a heat-absorbing plate 22. In addition, the heat-conducting component 20 may also include a baffle plate 23.
[0010] The main body 10 is provided with an inlet connector and an outlet connector for connecting pipe fittings (not shown). In addition, the main body 10 is provided with a flow channel communicating with the inlet connector and the outlet connector, so that coolant (not shown) flows into the main body 10 from the inlet connector and flows out of the main body 10 from the outlet connector.
[0011] The condenser plate 21 is fixed to the body 10, for example, by screws. The condenser plate 21 and the body 10 form a heat exchange chamber S (please refer to Figure 5 first). The condenser plate 21 has an inner surface 211, an outer surface 212, and a plurality of fin structures 213. The inner surface 211 faces the heat exchange chamber S, and the outer surface 212 faces away from the inner surface 211. These fin structures 213 protrude from the inner surface 211.
[0012] The heat absorber plate 22 is located on the side of the condenser plate 21 away from the main body 10, while the guide plate 23 is located between the condenser plate 21 and the heat absorber plate 22. The condenser plate 21, the guide plate 23, and the heat absorber plate 22 are fixed and sealed together, for example, by welding. The heat absorber plate 22 is used for thermal coupling to a heat source (not shown), such as a central processing unit or a graphics processor.
[0013] The condenser plate 21 also has a condensation channel 214, which is formed by a recess from the outer surface 212 of the condenser plate 21. The condensation channel 214 is a meandering channel and includes a plurality of first straight segments 2141 and a plurality of first turning segments 2142. These first straight segments 2141 are parallel and spaced apart, and these first straight segments 2141 are sequentially connected through these first turning segments 2142.
[0014] The heat absorber plate 22 has an evaporation channel 221. The evaporation channel 221 is a meandering channel and includes a plurality of second straight segments 2211 and a plurality of second bend segments 2212. These second straight segments 2211 are parallel and spaced apart, and these second straight segments 2211 are sequentially connected through these second bend segments 2212.
[0015] The guide plate 23 has a plurality of connecting holes 231, which are arranged along two parallel straight lines on opposite sides of the guide plate 23.
[0016] Next, please refer to Figures 4 to 6. Figure 4 is a bottom view of the water-cooled head of Figure 1. Figure 5 is a cross-sectional view drawn along section line 5-5 of Figure 4. Figure 6 is a cross-sectional view drawn along section line 6-6 of Figure 4.
[0017] In this embodiment, the first straight segments 2141 of the condensation channel 214 are parallel to the second straight segments 2211 of the evaporation channel 221, and the first straight segments 2141 are respectively aligned with the second straight segments 2211. The first turning segments 2142 of the condensation channel 214 are respectively configured opposite to the second turning segments 2212 of the evaporation channel 221. That is, for two adjacent first straight segments 2141 and two adjacent second straight segments 2211 aligned with them, the first turning segment 2142 connecting the two first straight segments 2141 is relative to the second turning segment 2212 connecting the two second straight segments 2211. The connecting holes 231 of the guide plate 23 connect the first turning segments 2142 and the second turning segments 2212.
[0018] In this embodiment, the flow channel structure formed by the evaporation channel 221, the connecting hole 231, and the condensation channel 214 is similar to the internal flow channel structure of a flat-plate pulse heat pipe, and is used for the flow of working fluid (not shown). After the heat absorber plate 22 absorbs the heat generated by the heat source, the heat drives the liquid working fluid to flow in the evaporation channel 221 in the heat absorber plate 22 and vaporizes the working fluid. The vaporized working fluid flows through the connecting hole 231 of the guide plate 23 to the condensation channel 214 of the condenser plate 21 to transfer heat to the condenser plate 21. At this time, the coolant flowing into the body 10 will exchange heat with these fin structures 213 of the condenser plate 21 in the heat exchange chamber S, and then leave the heat exchange chamber S to remove the heat. On the other hand, after the working fluid transfers heat to the condenser plate 21, it condenses back into liquid, and the liquid working fluid flows from the connecting hole 231 to the evaporation channel 221 to continue absorbing heat.
[0019] In this embodiment, by installing a condenser plate 21 on the body 10 and a heat absorber plate 22 on the side of the condenser plate 21 away from the body 10, and by connecting the evaporation channel 221 of the heat absorber plate 22 with the condensation channel 214 of the condenser plate 21, the heat generated by the heat source can be uniformly conducted from the heat absorber plate 22 to the condenser plate 21 through the phase-changing working fluid in the evaporation channel 221. In this way, the heat exchange efficiency between the coolant flowing through the body 10 and the condenser plate 21 is improved, thereby improving the heat dissipation efficiency of the water cooling head 1.
[0020] Next, please refer to Figures 7 to 9. Figure 7 is a perspective view of the water cooling head according to the second embodiment of the present invention. Figure 8 is an exploded view of the water cooling head of Figure 7. Figure 9 is an exploded view of the water cooling head of Figure 7 from another perspective.
[0021] In this embodiment, the water-cooled head 1a includes a body 10a and a heat-conducting component 20a. The heat-conducting component 20a includes a condenser plate 21a and a heat-absorbing plate 22a.
[0022] The main body 10a is provided with an inlet connector and an outlet connector for connecting pipe fittings (not shown). In addition, the main body 10a has a flow channel inside that connects the inlet connector and the outlet connector, so that coolant (not shown) flows into the main body 10a from the inlet connector and flows out of the main body 10a from the outlet connector.
[0023] A condenser plate 21a is installed on the body 10a. The condenser plate 21a and the body 10a form a heat exchange chamber Sa (please refer to Figure 12 first). The condenser plate 21a has an inner surface 211a and an outer surface 212a, with the inner surface 211a facing the heat exchange chamber Sa and the outer surface 212a facing away from the inner surface 211a.
[0024] The heat absorber plate 22a is located on the side of the condenser plate 21a away from the body 10a. The condenser plate 21a and the heat absorber plate 22a are fixed to the body 10a, for example, with screws. The heat absorber plate 22a is used to thermally couple to a heat source (not shown), such as a central processing unit or a graphics processor.
[0025] Next, please refer to Figures 10 and 11. Figure 10 is a bottom view of the water cooling head of Figure 7. Figure 11 is a cross-sectional view drawn along section line 11-11 of Figure 10.
[0026] The condenser plate 21a also has a plurality of heat exchange channels 215a and a plurality of condensation channels 214a. These heat exchange channels 215a are formed by recesses in the inner surface 211a of the condenser plate 21a. These heat exchange channels 215a are straight channels and are arranged in parallel and at intervals. These condensation channels 214a are formed by recesses in the outer surface 212a of the condenser plate 21a. These condensation channels 214a are straight channels and are arranged in parallel and at intervals. These heat exchange channels 215a and these condensation channels 214a are arranged alternately to form a louvered fin structure 213a, and these heat exchange channels 215a and these condensation channels 214a are not connected.
[0027] Next, please refer to Figures 10, 12 and 13. Figure 12 is a perspective view of the heat absorber plate of Figure 8. Figure 13 is a cross-sectional view drawn along section line 13-13 of Figure 10.
[0028] The heat absorption plate 22a has a plurality of evaporation channels 221a and a plurality of connecting grooves 222a. These evaporation channels 221a are straight channels and are arranged parallel to each other and spaced apart. These connecting grooves 222a are located at opposite ends of these evaporation channels 221a. These condensation channels 214a and these evaporation channels 221a are arranged alternately, and these evaporation channels 221a are connected to these condensation channels 214a through these connecting grooves 222a. For example, these evaporation channels 221a and these condensation channels 214a are alternately connected through these connecting grooves 222a.
[0029] In this embodiment, the heat absorption plate 22a may also have a connecting channel 223a, which connects the two outermost evaporation channels 221a.
[0030] In this embodiment, the flow channel structure formed by the evaporation channel 221a, the connecting groove 222a, and the condensation channel 214a is similar to the internal flow channel structure of a flat-plate pulse heat pipe, and is used for the flow of working fluid (not shown). After the heat absorber plate 22a absorbs the heat generated by the heat source, the heat drives the liquid working fluid to flow in the evaporation channel 221a in the heat absorber plate 22a and vaporizes the working fluid. The vaporized working fluid flows through the connecting groove 222a of the heat absorber plate 22a to the condensation channel 214a of the condenser plate 21a to transfer heat to the condenser plate 21a. At this time, the coolant flowing into the body 10a will exchange heat with the fin structure 213a of the condenser plate 21a in the heat exchange chamber Sa, and then leave the heat exchange chamber Sa to carry away the heat. On the other hand, after the working fluid transfers heat to the condenser plate 21a, it condenses back into liquid, and the liquid working fluid flows back from the connecting groove 222a to the evaporation channel 221a to continue absorbing heat.
[0031] In this embodiment, by installing a condenser plate 21a on the body 10a and a heat absorber plate 22a on the side of the condenser plate 21a away from the body 10a, and by connecting the evaporation channel 221a of the heat absorber plate 22a with the condensation channel 214a of the condenser plate 21a, the heat generated by the heat source can be uniformly conducted from the heat absorber plate 22a to the condenser plate 21a through the phase-changing working fluid in the evaporation channel 221a. In this way, the heat exchange efficiency between the coolant flowing through the body 10a and the condenser plate 21a is improved, thereby improving the heat dissipation efficiency of the water cooling head 1a.
[0032] Furthermore, by means of the heat exchange channels 215a of the condenser plate 21a being recessed from the inner surface 211a of the condenser plate 21a, and the condensation channels 214a being recessed from the outer surface 212a of the condenser plate 21a, and these heat exchange channels 215a and these condensation channels 214a being arranged alternately to form a louver-shaped fin structure 213a, the heat exchange area between the coolant and the condenser plate 21a can be increased, thereby improving the heat dissipation efficiency of the water cooling head 1a.
[0033] It should be noted that the evaporation channel 221a of the heat absorber plate 22a and the condensation channel 214a of the condenser plate 21a are connected through the connecting groove 222a of the heat absorber plate 22a, but this is not a limitation. In other embodiments, the heat absorber plate may not have a connecting groove, while the condenser plate may have a connecting groove, so that the evaporation channel of the heat absorber plate and the condensation channel of the condenser plate are connected through the connecting groove of the condenser plate.
[0034] According to the water cooling head disclosed in the above embodiment, by means of a condenser plate mounted on the main body and a heat absorber plate mounted on the side of the condenser plate away from the main body, and the evaporation channel of the heat absorber plate being connected to the condensation channel of the condenser plate, heat generated by the heat source can be uniformly transferred from the heat absorber plate to the condenser plate through the working fluid undergoing phase change within the evaporation channel. In this way, the heat exchange efficiency between the coolant flowing through the main body and the condenser plate is improved, thereby improving the heat dissipation efficiency of the water cooling head.
[0035] Although the present invention has been disclosed above with reference to the preferred embodiments described above, it is not intended to limit the present invention. Any person skilled in the art may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to this specification. [Simplified Explanation of the Diagram]
[0036] Figure 1 is a perspective view of the water-cooled head according to the first embodiment of the present invention. Figure 2 is an exploded view of the water-cooled head of Figure 1. Figure 3 is an exploded view of the water-cooled head of Figure 1 from another perspective. Figure 4 is a bottom view of the water-cooled head of Figure 1. Figure 5 is a cross-sectional view drawn along section line 5-5 of Figure 4. Figure 6 is a cross-sectional view drawn along section line 6-6 of Figure 4. Figure 7 is a perspective view of the water-cooled head according to the second embodiment of the present invention. Figure 8 is an exploded view of the water-cooled head of Figure 7. Figure 9 is an exploded view of the water-cooled head of Figure 7 from another perspective. Figure 10 is a bottom view of the water-cooled head of Figure 7. Figure 11 is a cross-sectional view drawn along section line 11-11 of Figure 10. Figure 12 is a perspective view of the heat-absorbing plate of Figure 8. Figure 13 is a cross-sectional view drawn along section line 13-13 of Figure 10.
Claims
1. A water cooling head, comprising: a body; and a heat-conducting assembly, comprising: a condenser plate disposed on the body, the condenser plate having a condensation channel; and a heat-absorbing plate disposed on the side of the condenser plate away from the body, the heat-absorbing plate having an evaporation channel; and a guide plate disposed between the condenser plate and the heat-absorbing plate, the guide plate having a plurality of connecting holes, the evaporation channel being connected to the condenser channel through the connecting holes.
2. The water cooling head as described in claim 1, wherein both the condensation channel and the evaporation channel are meandering channels, the condensation channel includes a plurality of first straight segments and a plurality of first bend segments, the first straight segments are parallel and spaced apart, and the first straight segments are sequentially connected through the first bend segments, and the evaporation channel includes a plurality of second straight segments and a plurality of second bend segments, the second straight segments are parallel and spaced apart, and the second straight segments are sequentially connected through the second bend segments.
3. The water block as described in claim 2, wherein the first straight segments are respectively aligned with the second straight segments, the first bend segments are respectively disposed opposite to the second bend segments, and the connecting holes connect the first bend segments and the second bend segments.
4. The water cooling head as described in claim 3, wherein the connecting holes are arranged along two parallel straight lines on opposite sides of the baffle.
5. The water cooling head as claimed in claim 1, wherein the condenser plate and the body form a heat exchange chamber, the condenser plate has an inner surface, an outer surface and a plurality of fin structures, the inner surface faces the heat exchange chamber, the outer surface faces away from the inner surface, the fin structures protrude from the inner surface, and the condensation channel is formed by recessing from the outer surface.
6. A water cooling head, comprising: a body; and a heat-conducting assembly, comprising: a condenser plate disposed on the body, the condenser plate having a plurality of condensation channels, the condensation channels being straight channels, the condensation channels being parallel and spaced apart; and a heat-absorbing plate disposed on the side of the condenser plate away from the body, the heat-absorbing plate having a plurality of evaporation channels, the evaporation channels being straight channels, the evaporation channels being parallel and spaced apart, and the evaporation channels and the condensation channels being connected.
7. The water cooling head as claimed in claim 6, wherein the condenser channels and the evaporator channels are arranged alternately, the heat absorber plate has a plurality of connecting slots located at opposite ends of the evaporator channels, and the evaporator channels are connected to the condenser channels through the connecting slots.
8. The water cooling head as described in claim 7, wherein the evaporation channels and the condensation channels are alternately connected through the connecting slots.
9. The water cooling head as claimed in claim 8, wherein the heat absorption plate further comprises a connecting channel that connects the two outermost of the evaporation channels.
10. The water cooling head as claimed in claim 6, wherein the condenser plate and the body form a heat exchange chamber, the condenser plate having an inner surface, an outer surface and a plurality of heat exchange channels, the inner surface facing the heat exchange chamber, the outer surface facing away from the inner surface, the heat exchange channels being recessed from the inner surface, the condensation channels being recessed from the outer surface, and the heat exchange channels and the condensation channels being staggered and not connected.
