Substrate processing method and substrate processing apparatus

Abstract

This invention provides a substrate processing method and apparatus that can fill an appropriate amount of filler according to the volume distribution of the gaps at the periphery of a multilayer substrate, thereby improving the yield. The substrate processing method of this invention involves filling the gaps G at the periphery P of a multilayer substrate Ws having multiple substrates, and includes: a transmitted image acquisition step S2, which acquires a top-view transmitted image of the periphery P of the multilayer substrate Ws; an area calculation step S3, which calculates the top-view area of ​​the gaps G at the periphery P based on the transmitted image; and a filling step S4, which fills the gaps G at the periphery P with filler; wherein the amount of filler filled in the filling step S4 is adjusted based on the area calculated in the area calculation step S3.

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