Package structure and method of forming the same

Abstract

Provided is a package structure and a method of forming the same. The method includes bonding a first integrated circuit component onto an interposer, wherein the first integrated circuit component has a recess filled with a sacrificial material therein; forming an underfill layer on the interposer to laterally surround the first integrated circuit component; forming an encapsulant on the interposer to laterally encapsulate the underfill layer and the first integrated circuit component; removing a portion of the encapsulant to expose the sacrificial material within the recess of the first integrated circuit component; and removing the sacrificial material to expose the recess of the first integrated circuit component.

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