Semiconductor structure and methods for forming the same and packaging structure
TW202638969APending Publication Date: 2026-09-16TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- TW114117659
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-13
- Filing Date
- 2025-05-12
- Publication Date
- 2026-09-16
Smart Images
Figure 00000000_0000_ABST
Abstract
A semiconductor structure includes a lower redistribution layer (RDL) structure, a lower molded portion including an interconnect die on the lower RDL structure, an upper RDL structure on the lower molded portion, and a guard ring including a lower RDL portion in the lower RDL structure, a lower via portion in the lower molded portion, and an upper RDL portion in the upper RDL structure.
Need to check novelty before this filing date? Find Prior Art