Modular coaxial bridge

Abstract

µm-micron wide copper traces that are typically implemented in a silicon dioxide dielectric material as individual strip lines or a microstrip of individual transmission lines. These existing copper transmission lines are unable to transmit signals at high frequencies without introducing a significant bit error rate. The modular coaxial bridge described herein can replace these traditional interconnect techniques by the densely packaging a large number of individual coaxial transmission lines into a single modular unit. This coaxial bridge greatly reduces the insertion loss transmissions between dies on an interposer, resulting in transmission speeds greater than

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