Lead frame and its manufacturing method
TW202638977APending Publication Date: 2026-09-16SHINKO ELECTRIC IND CO LTD
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Patent Information
- Application Number
- TW115108891
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-14
- Filing Date
- 2026-03-11
- Publication Date
- 2026-09-16
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Figure TWG2TA001077343_001 
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Abstract
A lead frame with a shape that facilitates the subdivision of resist during removal in manufacturing is provided. The lead frame includes: a plurality of product areas arranged separately from each other in a first direction; and a frame portion supporting each of the product areas from a peripheral side. The frame portion includes: a first region, located on one side of each of the product areas in a top view and extending in the first direction; a second region, located opposite the first region across each of the product areas in a top view; a first groove provided in the first region and the second region and opening on the upper surface of the frame portion; and a second groove provided in the first region and the second region and opening on the lower surface of the frame portion. The first groove and the second groove are positioned in a position that does not overlap in a top view.
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