Passing signals through micro device sidewalls
TW202638978APending Publication Date: 2026-09-16VUEREAL INC
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Patent Information
- Application Number
- TW114146439
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2020-05-11
- Filing Date
- 2021-05-11
- Publication Date
- 2026-09-16
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Abstract
The present invention relates to structure and formation of side walls in micro devices. The structure allows access of one side of the micro device to another side through conductive layers and pads. In particular, the top and bottom sides of the micro devices are in direction of the current in the device and sidewalls are isolation surfaces surrounding the top and bottom sides of the device.
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