Substrate, frame structure and packaging process

TW202638979APending Publication Date: 2026-09-16ASE GLOBAL INTEGRATED SOLUTIONS CO LTD
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Patent Information

Application Number
TW114107774
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-03-03
Publication Date
2026-09-16

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Abstract

The present invention discloses a substrate, a frame structure, a packing process. The substrate includes at least one strip area. The strip area includes an available area. The available area inlcudes a plurality of unit areas. An area of the available area is more than
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