Semiconductor structure and manufacturing method threreof
TW202638983APending Publication Date: 2026-09-16SILICONWARE PRECISION IND CO LTD
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Patent Information
- Application Number
- TW114107724
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-03-03
- Publication Date
- 2026-09-16
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Figure TWG2TA001075493_001 
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Figure TWG2TA001075493_003
Abstract
The present invention provides a semiconductor structure and its manufacturing method which mainly provide a semiconductor base, which is defined with adjacent active area and idle area, wherein the active area is provided with a plurality of semiconductor base units, and each semiconductor base unit is defined with an electrical contact dense area and an electrical contact sparse area, then a plurality of conductive bumps are electroplated on each semiconductor base unit in the active area and a plurality of current control bumps are electroplated in the idle area to avoid uneven distribution of electroplating current.
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