Electronic devices based on wafer on wafer packaging technology

Abstract

The present disclosure is related to an electronic device based on a wafer on wafer packaging technology. The electronic device includes a first circuit layer, a second circuit layer and a waveguide connector. The first circuit layer includes a first photoelectric conversion device, and the first photoelectric conversion device is used for transmitting or receiving an optical signal. The second circuit layer includes a second photoelectric conversion device and is disposed on the first circuit layer. The second photoelectric conversion device is used for transmitting or receiving the optical signal. The waveguide connector is disposed between the first circuit layer and the second circuit layer, and is used for transmitting the optical signal. Therefore, different circuit layers in an electronic device can use optical signals to achieve high-speed data transmission, which can reduce the number of connectors required for data transmission and achieve the effect of reducing the manufacturing cost and operating energy consumption of the electronic device.

Images