Package substrate and fabricating method thereof
TW202638995AInactive Publication Date: 2026-09-16AALTOSEMI INC
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Patent Information
- Application Number
- TW114111249
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-12
- Filing Date
- 2025-03-25
- Publication Date
- 2026-09-16
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
A packaging substrate is made by combining an insulating layer on a core layer and then forming a through hole to form a wiring layer on the insulating layer, and forming a conductive via in the through hole to electrically connect the wiring layer. A circuit structure is formed on the insulating layer. Therefore, the arrangement of the insulating layer facilitates the combination of the wiring layer and the core layer.
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