Semiconductor package having internal isolation and copper heat spreader

TW202638996APending Publication Date: 2026-09-16ALPHA & OMEGA SEMICON INT LP
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW114140571
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-14
Filing Date
2025-10-21
Publication Date
2026-09-16

Smart Images

  • Figure TWG2TA001076339_001
    Figure TWG2TA001076339_001
  • Figure TWG2TA001076339_002
    Figure TWG2TA001076339_002
  • Figure TWG2TA001076339_003
    Figure TWG2TA001076339_003
Patent Text Reader

Abstract

A semiconductor package comprising a composite layer, a lead frame, a first semiconductor device, a second semiconductor device, and a molding encapsulation. The lead frame comprises a plurality of leads and a copper heat spreader. A lead frame strip comprises a plurality of lead frames and a plurality of interim members. Each lead frame of the plurality of lead frames comprises a plurality of leads and a copper heat spreader. Each interim member of the plurality of interim members comprises a lower section, a slanted section, and an upper section.
Need to check novelty before this filing date? Find Prior Art