Integrated package and method for making the same

Abstract

This application provides an integrated package and a method for manufacturing the same. The integrated package may include: a substrate; a first electronic component mounted on the substrate; a first dielectric layer formed on the substrate and covering the first electronic component, wherein the dielectric layer is made of a photoimageable dielectric material; a first redistribution layer formed in the first dielectric layer, wherein the first redistribution layer includes a first vertical portion extending through the first dielectric layer and a first lateral portion formed on the top surface of the first dielectric layer; a second electronic component mounted above the first dielectric layer and coupled to the lateral portion of the first redistribution layer; and a second dielectric layer formed above the first dielectric layer and covering the second electronic component.

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