Semiconductor device and method of fabricating thereof

TW202639006APending Publication Date: 2026-09-16TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information

Application Number
TW114117978
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-14
Filing Date
2025-05-13
Publication Date
2026-09-16

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    Figure TWG2TA001076119_002
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    Figure TWG2TA001076119_003
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Abstract

A first bonding structure is positioned with respect to a second bonding structure. The first bonding structure includes a first alignment component. The second bonding structure includes a second alignment component that faces toward the first alignment component in a vertical direction. A relative position between the first alignment component and the second alignment component is shifted in at least a first horizontal direction while the first alignment component and the second alignment component. An electrical current is measured through the first alignment component and the second alignment component while the relative position between the first alignment component and the second alignment component is shifted in the first horizontal direction. The first bonding structure is bonded to the second bonding structure based on a result of the measuring of the electrical current.
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