Neural processing unit semiconductor package and artificial intelligence processor package

Abstract

According to an example of the present invention, a neural processing unit (NPU) semiconductor package and an artificial intelligence processor (AI) package are provided. The NPU semiconductor package may include: a semiconductor package substrate; an NPU chip, rotated at a first angle relative to a plane and mounted on the semiconductor package substrate; and one or more Static Random Access Memory (SRAM) chips, rotated at a second angle relative to a plane and mounted adjacent to the NPU chip on the semiconductor package substrate. The first and second angles can be determined such that the size of the semiconductor package substrate is smaller than a certain form factor.

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