conductive adhesive supply device

TW202639233APending Publication Date: 2026-10-01PELNOX
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Patent Information

Application Number
TW114112332
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-28
Filing Date
2025-03-31
Publication Date
2026-10-01

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Abstract

[Problem] This invention provides a conductive adhesive supply device, which is an adhesive supply device that mixes multiple chemical substances to exhibit adhesive strength, and can use up each chemical substance before mixing without waste. [Solution] One of the conductive adhesive supply devices 100 of this invention includes an integrally formed first syringe 12a and a second syringe 12b, wherein, in the first syringe 12a, a main agent (A) 72 is contained between the first dispensing portion 14a of the first syringe 12a and a first viscoelastic body 20a, and the main agent (A) 72 contains a dispersed first conductive filler (C1) 72a and an epoxy resin as the main component; in the second syringe 12b, a second dispensing portion 14b of the second syringe 12b and a first dispensing portion 14a of the second syringe 12b and a first viscoelastic body 20a are contained between the first dispensing portion 14a of the first syringe 12a and a first viscoelastic body 20a; the main agent (A) 72 contains a dispersed first conductive filler (C1) 72a and an epoxy resin as the main component; in the second syringe 12b, a second dispensing portion 14b of the second syringe 12b and a first dispensing portion 14a of the second syringe 12b and a first dispensing portion 14a of the second syringe 12b are contained between the first dispensing portion 14a of the first syringe 12a and a first viscoelastic body 20a; the second dispensing portion 14a of the second syringe 12b and the second ...2b of the second syringe 12b are contained between the first dispens The second viscoelastic body 20b contains a hardener (B) 74, and the hardener (B) 74 contains a dispersed second conductive filler (C2) 74a; the first viscoelastic body 20a is non-reactive or poorly reactive relative to the main agent (A) 72 and the first conductive filler (C1) 72a, and is non-wetting or difficult to wet; and the second viscoelastic body 20b is non-reactive or poorly reactive relative to the hardener (B) 74 and the second conductive filler (C2) 74a, and is non-wetting or difficult to wet.
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