Method for cleaning a wafer chuck and characterization system

TW202639237APending Publication Date: 2026-10-01KLA CORP
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Patent Information

Application Number
TW115118254
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2019-11-13
Filing Date
2020-05-25
Publication Date
2026-10-01

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Abstract

A cleaning assembly is disclosed. The cleaning assembly includes a substrate. One or more patterns are formed on a bottom side of the substrate. One or more structures within the one or more patterns attract one or more particles from a chuck via at least one of electrostatic attraction or mechanical trapping when the substrate is positioned on the chuck.
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