Copper paste composition for sintering and electronic components
TW202639252APending Publication Date: 2026-10-01NOF CORP
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Patent Information
- Application Number
- TW115109603
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-18
- Filing Date
- 2026-03-16
- Publication Date
- 2026-10-01
Abstract
This invention provides a copper paste composition for sintering, comprising 60-95% by mass of (A) copper particles, 0.1-10% by mass of (B) a sintering aid for conductive paste as shown in formula (1) or formula (2) below, and 1-30% by mass of (C) an organic solvent. This copper paste composition for sintering can form a sintered body with excellent conductivity and bonding properties even under atmospheric conditions, and can provide electronic components having the sintered body.
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