Method for manufacturing a bonding composition and a bonding structure

Abstract

This invention provides a bonding composition capable of obtaining a bonded structure with excellent bonding reliability, and a method for manufacturing a bonded structure using the above-described bonding composition. The bonding composition comprises copper powder, an organic solvent, and copper carboxylate. The content of the organic solvent in the bonding composition is 1% by mass to 20% by mass, and the total number of carbons from carboxylic acids in the structural formula of the copper carboxylate is 4 or more. The solubility of copper carboxylate in the organic solvent is 0.005 g / g or less at 25°C.