Processing device and alignment method

Abstract

The purpose of this invention is to improve alignment accuracy and increase production volume in processing apparatuses such as laser processing apparatuses and exposure apparatuses. In a laser processing apparatus 100, a substrate W is prepared, with segmented regions D1 to D4 defined by the arrangement of alignment marks P. Alignment cameras 75A to 75D are arranged around a projection optical system 50 at distances corresponding to the dimensions of the segmented regions D1 to D4. When the substrate W is mounted on the processing platform 70 and alignment is performed, each of the alignment cameras 75A, 75B, 75C, and 75D captures images of alignment marks AM1 to AM4, BM1 to BM4, CM1 to CM4, and DM1 to DM4 within the corresponding segmented regions D1 to D4.

Images