Laser processing apparatus

TW202639267APending Publication Date: 2026-10-01TECHNICS
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Patent Information

Application Number
TW114150104
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-04-19
Publication Date
2026-10-01

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Abstract

A laser processing apparatus is disclosed. The disclosed laser processing apparatus includes: a laser device that generates a pulsed laser beam, wherein in a waveform of the pulsed laser beam, the forward slope before reaching a peak value is gentler than the backward slope after reaching the peak value; and a focusing optical system that focuses the pulsed laser beam provided in the laser device onto a processing object. The focusing optical system is configured to focus the pulsed laser beam onto the processing object to generate a crack for cutting the processing object.
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