Polishing apparatus and polishing method

Abstract

A grinding apparatus and grinding method are provided that can accurately determine the position of the measuring point for the film thickness of a workpiece. The grinding apparatus includes: a grinding head (1) that presses the workpiece (W) onto a grinding pad (2) on a grinding table (3) and grinds the workpiece; a film thickness sensor (25) for measuring the film thickness at the measuring point on the surface (S1) of the workpiece (W); an infrared camera (27) that generates a first image and a second image of a feature region (100) on the surface (S1) from the back side (S2) of the workpiece (W) at predetermined time intervals; and a processing control unit (9) that determines the coordinates of the measuring point on the surface (S1) of the workpiece (W) based on the first image and the second image.

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