Wafer-level direct bonding using dispensable optically clear adhesive for augmented reality glasses lamination

Abstract

Embodiments of the present disclosure generally relate to augmented reality (AR) displays. More specifically, embodiments described herein relate to an AR lens assembly and methods of forming such assemblies. In some embodiments, a method of forming a lens assembly includes disposing an optically clear adhesive onto a surface of a wafer level optical stack. The method further includes exposing the optically clear adhesive to an ultraviolet (UV) source to at least partially cure the optically clear adhesive. The method further includes laminating a substrate onto the optically clear adhesive to form a wafer level optical assembly. The method further includes post-processing the optical assembly to form a plurality of lens assemblies.

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