Expanding material with compound slits, preparation method and applications thereof, and die for forming slits

TW202639322APending Publication Date: 2026-10-013M INNOVATIVE PROPERTIES CO
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Patent Information

Application Number
TW115121518
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2020-07-29
Filing Date
2020-12-22
Publication Date
2026-10-01

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Abstract

The present disclosure relates generally to tension-activated, expanding articles that include compound slit patterns. In some embodiments, these articles are used as cushioning films and / or packaging materials. The present disclosure also relates to methods of making and using these tension-activated, expanding articles.
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