Stacked substrate and packaging assembly

Abstract

This invention discloses a stacked substrate including a first tiling layer, a second tiling layer, and an adhesive layer. The first tiling layer includes a plurality of adjacent first tiling substrates and a plurality of first tiling seams located between the first tiling substrates. The second tiling layer includes a plurality of adjacent second tiling substrates and a plurality of second tiling seams located between the second tiling substrates. The bonding layer is disposed between the first and second tiling layers and defines a first bonding surface and a second bonding surface to connect the first and second tiling layers. Along a projection direction perpendicular to the first or second bonding surface or both bonding surfaces of the bonding layer, at least a portion of the first and second tiling seams do not coincide.

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