Heat conduction sheet
TW202639332APending Publication Date: 2026-10-01SHOWA MARUTSUTSU CO LTD
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Patent Information
- Application Number
- TW115100979
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-01-21
- Filing Date
- 2026-01-09
- Publication Date
- 2026-10-01
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Figure TWG2TA001078994_001 
Figure TWG2TA001078994_002 
Figure TWG2TA001078994_003
Abstract
MPa is applied in the thickness direction of the heat conductive sheet in the natural state, the thickness under compression is T2 [mm], and the thickness after
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