Manufacturing methods of copper-clad laminates, printed circuit boards, semiconductor packages, and copper-clad laminates

Abstract

This invention relates to a copper-clad laminate and its manufacturing method, as well as a printed circuit board and semiconductor package using the copper-clad laminate. The copper-clad laminate comprises: an insulating layer containing resin; and copper foil disposed on at least one side of the insulating layer; wherein the copper foil is a surface-treated copper foil having a metal treatment layer containing zinc, and the zinc content in the metal treatment layer is 10 to 2,500 μg / dm2. none